| 赵朋,林洁馨,傅兴华.三维集成电路硅通孔热特性的COMSOL模型[J].唐山学院学报,2016,29(3):41-46 |
| 三维集成电路硅通孔热特性的COMSOL模型 |
| The COMSOL Model for Through-Silicon Via Thermal Characteristics of Three-Dimensional Integrated Circuit |
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| DOI：10.16160/j.cnki.tsxyxb.2016.03.013 |
| 中文关键词: 三维集成电路 硅通孔 散热问题 COMSOL模型 |
| 英文关键词: three-dimensional integrated circuit through-silicon via cooling problem the COMSOL model |
| 基金项目:国家自然科学基金地区科学基金项目(61464002);贵州省科技合作项目(黔科合LH字[2015]7636) |
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| 中文摘要: |
| 利用COMSOL软件建立了三维集成电路散热模型并进行仿真。仿真结果显示,在元胞块之间插入TSV网络可以有效将三维集成电路温度控制在一个安全范围之内,而且随着TSV半径的增大,三维集成电路散热效果更好。 |
| 英文摘要: |
| The COMSOL model for the 3D IC heat dissipation is established to simulate. The simulation results show that TSV network can effectively control the temperature of the 3D IC within a safe range, and when increasing the radius of TSV, three-dimensional integrated circuit may have a better cooling effect. |
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